Fully equipped cleanroom for microfabrication: electronic device, thin film coating, surface patterning.High flexibiliy and customization
Maximum wafer diameter: 6”
Cleanroom space rental
Mems and sensors

In our cleanroom complex microstructures can be realized.
We provide photolithographic process, thin film deposition and dry/wet etching.
We perform the whole process (from silicon wafer to device) or single technological step.
Any need will be processed with the most appropriate technique

Thin Film coating

Deposition methods

Thermal evaporationE-beamDC e RF Magnetron SputteringReactive Magnetron Sputtering

Coatings

Metals (Al, Cu, Ni, Cr, Ti, Sn, Mo, etc.)Precious metals (Au, Ag, Pt)Semiconductors (Si, Ge)Oxides (SiO2, TiO2, Ta2O5, Al2O2, etc.)Hard coatings (SiC, WC, etc.)

Substrate

Silicon, Metals, Plastics, Glass, Optical fiber…We are open to test different material and substrate
Surface patterning

We customizes surface micro- and nano- patterning for different application
e.g. superhydrophobicity, self-cleaning, antifog, antimicrobial, biosensing…
We will find the best strategy to get the required morphology effects:

subtractive techniques (etching)additive techniques (depositing particles on the surface)soft lithographysurface structure can be coupled with chemical functionalization
Case study

Aim of the project
We demonstrate the feasibility of a deep through etch for the realization of a sensor for aerospace applications.

该项目的目的我们证明了深穿透蚀刻用于实现航空航天应用的传感器的可行性。结果对深反应离子刻蚀(DRIE)工艺进行了标定。

结果深度反应离子刻蚀(DRIE)工艺进行了标定。

Challenges

passing through etch on 525m siliconhigh verticality of the etched walls

525米硅高垂直度腐蚀墙面的挑战通过腐蚀

Results
DRIE (Deep Reactive Ion Etching) process have been calibrated especially for this application.

热辊技术研究中心
Hot Roller Tech
通讯地址:
北京市通州区兴光四街三号

3# 4th Street  XingGuang Tongzhou District  Beijing

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