In our cleanroom complex microstructures can be realized.
We provide photolithographic process, thin film deposition and dry/wet etching.
We perform the whole process (from silicon wafer to device) or single technological step.
Any need will be processed with the most appropriate technique
Deposition methodsThermal evaporationE-beamDC e RF Magnetron SputteringReactive Magnetron Sputtering
CoatingsMetals (Al, Cu, Ni, Cr, Ti, Sn, Mo, etc.)Precious metals (Au, Ag, Pt)Semiconductors (Si, Ge)Oxides (SiO2, TiO2, Ta2O5, Al2O2, etc.)Hard coatings (SiC, WC, etc.)
SubstrateSilicon, Metals, Plastics, Glass, Optical fiber…We are open to test different material and substrate
We customizes surface micro- and nano- patterning for different application
e.g. superhydrophobicity, self-cleaning, antifog, antimicrobial, biosensing…
We will find the best strategy to get the required morphology effects:
Aim of the project
We demonstrate the feasibility of a deep through etch for the realization of a sensor for aerospace applications.
Challengespassing through etch on 525m siliconhigh verticality of the etched walls
DRIE (Deep Reactive Ion Etching) process have been calibrated especially for this application.